What is DOWSIL™ TC-6015 Thermal Conductive Encapsulant?
A two part product, room temperature curable and heat fast cure, self-adhesion, low specific gravity thermal conductive encapsulant.
Uses
PV Inverter
Energy Storage System
Automotive control unit/EV module
High-power modules
Benefits
Thermal conductivity 1.6W/m·K
Low density
High flowability/rheology control
Minimal filler settling and no hard caking
Room Temperature curable with accelerated heat option
Self-adhesion
Excellent flame retardancy UL 94 V-0; RTI 150 °C
High reliability performance
DOWSIL™ TC-6015 Thermally Conductive Encapsulant
Developed to meet the demand across industries including renewable energy, energy storage, new energy vehicles and 5G stations for higher thermal conductivity materials.