Silicones Take the Heat…Away
Managing heat in LED lamps and luminaires as well as modules is becoming more critical than ever as solid-state lighting challenges incumbent sources currently used in street lamps, industrial and office lighting and even illumination of sport venues. Such high-intensity applications will push increasingly compact LED designs to deliver more lumens, draw more power and, consequently, manage heat more efficiently than ever before.
While heat may be the enemy of LED performance and reliability, designers have a powerful ally for thermal management with Dow Consumer Solutions on their side.
Whether your design calls for thermally conductive adhesives, encapsulants, gels or dispensable pads, our broad portfolio of silicone materials offers a wide range of advanced, yet easily applied thermal management solutions for the entire LED value chain – from LED packages to lamps and luminaires.
Our wet-dispensed thermal management materials are available in a variety of viscosities and cure chemistries. After cure, many can withstand temperatures ranging from -45°C to 200°C. This offers LED designers an expansive toolkit for drawing heat away from sensitive components, and ensuring excellent performance over the expected lifetime of LEDs.
Thermal Interface Materials from Dow Consumer Solutions are compatible with a wide range of efficient application processes, including screen or stencil printing, or via proven dispensing equipment.
More than a world-class materials supplier, Dow Consumer Solutions is an expert and dedicated collaborator. If our Product Finder cannot identify an off-the shelf solution that meets your precise specifications, our expert application engineers will work with you to understand your application and identify how to best solve your needs.
Thermal Pads also eliminate the need for fiberglass carriers used in conventional fabricated pads. Thus, the technology can enable thinner bond lines and excellent compression, yet deliver higher thermal resistance.
Dispensable Thermal Pads are compatible with a wide range of efficient application processes, including standard screen or stencil print processes, or via standard dispensing equipment. The materials easily conform to complex and unevenly shaped substrates and cure in place, helping increase throughput and provide greater flexibility over deposited layer thickness.