Lighting Thermally and Electrically Conductive Materials
Silicones Take the Heat…Away
Managing heat in LED lamps and luminaires as well as modules is becoming more critical than ever as solid-state lighting challenges incumbent sources currently used in street lamps, industrial and office lighting and even illumination of sport venues. Such high-intensity applications will push increasingly compact LED designs to deliver more lumens, draw more power and, consequently, manage heat more efficiently than ever before.
While heat may be the enemy of LED performance and reliability, designers have a powerful ally for thermal management with Dow Chemical on their side.
Whether your design calls for thermally conductive adhesives, encapsulants, gels, compounds or dispensable pads, our broad portfolio of silicone materials offers a wide range of advanced, yet easily applied thermal management solutions.
Our wet-dispensed thermal management materials are available in a variety of viscosities and cure chemistries. After cure, many can withstand temperatures ranging from -45°C to 200°C. This offers LED designers an expansive toolkit for drawing heat away from sensitive components, and ensuring excellent performance over the expected lifetime of LEDs.
Thermal interface materials are compatible with a wide range of efficient application processes, including screen or stencil printing, or via proven dispensing equipment.
More than a world-class materials supplier, Dow Chemical is an expert and dedicated collaborator. If our Product Finder cannot identify an off-the shelf solution that meets your precise specifications, our expert application engineers will work with you to understand your application and identify how to best solve your needs.
Increase Thermal Performance and Simplify Manufacturing
From LED Lighting to Telecom applications, the pressure is on manufacturers to maximize the reliability and minimize the cost of their products. As a result, the need for more innovative and cost-effective thermal management is as high as ever, and Dispensable Thermal Pads from Dow Consumer Solutions deliver.
Offering a versatile, cost-effective alternative to pre-fabricated thermal pads, Dow Consumer Solutions' innovative new product line now enables manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrates. Moreover, our Dispensable Thermal Pad technology ensures excellent thermal management properties and reduced manufacturing cost.
Dispensable Thermal Pads from Dow Consumer Solutions Offer Your PCB System Assembly and Lighting Applications:
- Reduced Total Cost of Ownership: As dispensable thermal pads can be dispensed or printed directly onto a substrate
- Enhanced Reliability: Dispensable Thermal Pads contribute to more reliable product performance by protecting against impact, shock and thermal cycling. They also pose a lower risk of drying out compared to conventional thermal grease, which is important for outdoor lighting applications
- Enhanced Design and Thermal Managment: Offering thermal conductivity as high as 2.5 W/mK. Dispensable Thermal Pads also eliminate the need for fiberglass carriers used in conventional fabricated pads. Thus, the technology can enable thinner bond lines and excellent compression, yet deliver higher thermal resistance.
- Expanded Manufacturing Latitudes: Dispensable Thermal Pads are compatible with a wide range of effcient application processes, including standard screen or stencil print processes, or via standard dispensing equipment. The materials easily conform to complex and unevenly shaped substrates and cure in place, helping increase throughput and provide greater flexibility over deposited layer thickness.