Increase Performance, Not Heat
With Dow Consumer Solutions on your side, you have the advanced materials and proven expertise you need to protect your valuable processors from increasing operating temperatures. Our broad portfolio of thermal materials offer the high performance solutions you need to design more reliable computing systems with a lower total cost of ownership.
A proactive and collaborative innovator, Dow Consumer Solutions is also looking ahead to help develop next-generation solutions for exascale computing platforms. Optical interconnect based on our polymer waveguide silicones shifts the medium of data transmission from electrons to photons, and enables significant leaps in board-level data bandwidth versus copper-based interconnect.
This cutting-edge materials technology allows fabrication of next-generation optical waveguides on both rigid FR4 and flexible printed circuit board substrates using conventional film processing and photolithography techniques suitable for large-volume mass manufacturing. We continue to work closely with industry leaders to advance this innovative technology toward commercial application.