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PCB & Systems Assembly Adhesives and Sealants

Adhesive in syringe applied to seal of heat sink assembly around electronic circuit board

Taking the Stress out of Bonding

Whether your PCB module or system assembly demands an adhesive offering proven performance, flexible processing options, simpler assembly or thermal management, Dow Consumer Solutions' advanced silicone adhesives and sealants can help you achieve your most challenging design goals.

As a class of self-priming materials, Dow Consumer Solutions' silicone adhesives and sealants form reliable, long-lasting bonds to a variety of substrates, including ceramics, metals, glass and filled plastics – all without the need for mechanical fastening and clamping. Many of our solutions are recognized by Underwriter Laboratories or included on Mil Spec qualified product listings to ease compliance for finished parts.

Within our versatile portfolio, you will find a broad selection of viscosities and cure chemistries to meet your processing needs. Once cured, all Dow Consumer Solutions adhesives and sealants form strong, but flexible bonds that help dampen mechanical stress and vibration. They perform reliably over a wide range of operating temperatures – from -45°C to 200°C – and offer excellent dielectric insulation. Most of our silicone formulations are solventless, minimizing the need for special storage, handling or ventilation; and many are reworkable to allow for easier module repair.

Silicone Adhesives and Sealants from Dow Consumer Solutions Fall into Two Categories:

One-Part Moisture-Cure Grades One or Two-Part Heat-Cure Solutions
Our room-temperature vulcanized materials require no mixing or oven equipment to process. Instead, they draw moisture from ambient air to cure simply and cost-effectively. After cure, these materials form strong, but flexible bonds with proven performance in the most demanding applications. Dow Consumer Solutions broad selection of heat-cure silicone adhesives and sealants support high throughput production. Available in one- or two-part formulations, these versatile materials dispense easily at room temperature, yet cure quickly at any thickness at temperatures as low as 90°C. Higher temperatures accelerate cure times to further improve productivity.

In addition, Dow Consumer Solutions offers special adhesive grades with enhanced thermal conductivity, as well as the new Hot Melt Adhesives to enable slimmer smart devices manufactured more simply.
 

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FEATURED RESOURCE

New Chemistry for New Adhesion

With award winning Thermal Radical Cure™ technology, we’re reinventing the science behind the curing of adhesives. Cure and adhesion occur simultaneously — from the inside out.


Common Applications Where Our Materials have Delivered Decades of Proven Performance include:

  • Adhering module lids and baseplates 
  • Gasketing 
  • Sealing in and around wires and other openings in the module 
  • Protecting terminal electrodes 
  • Affixing components such as capacitors and coils to circuit boards 
  • Cushioning or stabilizing fragile components 
  • Sealing lids and housing grooves

Adhesion Made Easier

Enabling (better) adhesion or providing lower temperature adhesion could significantly expand the range of device design options. Low-temperature or room-temperature adhesion may also reduce energy or capital costs or increase manufacturing flexibility. Direct material costs may also be reduced when adhesion enhancers enable use of primerless silicones.

Surface treatments with Dow Consumer Solutions primers, prime coats and adhesion promoters can improve adhesion, ranging from simple cleaning to more complex etching or the application of reactive silane coupling agents to achieve optimal bonding.

Adhesives and Sealants Guide
Find the right silicone solution for your application.

DOWSIL™ EA-4600 LV Hot Melt RTV Wins 2018 Edison Award for Breakthrough Technology