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Thermally Conductive Adhesive Solutions

TC-2035 Thermally Conductive Adhesive dispensed in pattern on surface

Strong Bonds that Cool Components

The heat is on PCB boards and system assemblies as the number density and operating frequencies of components increase. As temperatures challenge conventional adhesive materials, Dow Consumer Solutions offers high-performance silicone solutions that can expand options for integration yet optimized processing and system costs.

Our market leading thermal adhesives range from low-viscosity liquids to non-slump formulations, and are available in two cure chemistries to meet your needs:

  1. One-part moisture-cure grades offer simple room-temperature processing to minimize equipment needs
  2. One- or two-part heat-cure solutions help accelerate processing and throughput

Our heat-cure, thermally conductive silicones develop no significant by-products during processing, making them ideal for confined applications, and they do not need mechanical fasteners or clamps. After cure, they convert into strong yet flexible elastomers, and deliver good unprimed adhesion to a variety of common substrates including metals, ceramics and filled plastics. A range of thermally conductive materials with the highest performing grades delivering thermal conductivity as high as 6.8 W/mK.

Our thermally conductive silicone adhesives enhance design and manufacturing flexibility by filling oddly-shaped gaps, reducing interfacial resistance and achieving extremely uniform bond lines, while compensating for board deviation and minor warping.

WEBINAR: Opportunities for Process Optimization with New Silicone Adhesives

NOW Possible: Strong Bonds and Effective Heat Dissipation
New DOWSIL™ TC-1500 Thermally Conductive Adhesive

A One-Part Thermally Conductive Heat Cure Adhesive
DOWSIL™ TC-2022 Thermally Conductive Adhesive

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