Thermally Conductive Adhesive Solutions
Strong Bonds that Cool Components
The heat is on PCB boards and system assemblies as the number density and operating frequencies of components increase. As temperatures challenge conventional adhesive materials, Dow Consumer Solutions offers high-performance silicone solutions that can expand options for integration yet optimized processing and system costs.
Our market leading thermal adhesives range from low-viscosity liquids to non-slump formulations, and are available in two cure chemistries to meet your needs:
- One-part moisture-cure grades offer simple room-temperature processing to minimize equipment needs
- One- or two-part heat-cure solutions help accelerate processing and throughput
Our heat-cure, thermally conductive silicones develop no significant by-products during processing, making them ideal for confined applications, and they do not need mechanical fasteners or clamps. After cure, they convert into strong yet flexible elastomers, and deliver good unprimed adhesion to a variety of common substrates including metals, ceramics and filled plastics. A range of thermally conductive materials with the highest performing grades delivering thermal conductivity as high as 6.8 W/mK.
Our thermally conductive silicone adhesives enhance design and manufacturing flexibility by filling oddly-shaped gaps, reducing interfacial resistance and achieving extremely uniform bond lines, while compensating for board deviation and minor warping.