Low Stress Encapsulants and Gels for Thermal Management
PCB systems assemblies often require effective thermal management as well as reliable protection from harsh environmental conditions. For these demanding applications, Dow Consumer Solutions has developed a broad selection of thermally conductive silicone elastomers and gels for potting delicate components. By maintaining thermal conductivity over the lifetime of the application, our versatile selection of silicone material solutions we provide higher reliability than alternative materials. We offer two categories:
- Encapsulants: Available in a variety of viscosities and cure chemistries, silicone encapsulants apply easily and cure into rubbery elastomers that provide reliable protection from harsh environmental conditions.
- Gels: Due to their remarkably low modulus, silicone gels are much softer and provide excellent stress relief in addition to dielectric insulation. They are typically used to protect the most sensitive and delicate components against the effects of thermal cycling.
Our thermally conductive encapsulants and gels offer simple room-temperature or heat-accelerated processing. Their low viscosity before cure that enables easy processing and potting of large or oddly shaped components. Whatever your thermal application need, gels and elastomers from Dow Consumer Solutions are designed to give you excellent performance at the lowest total cost of ownership.