Greases that Minimize Resistance, Maximize Performance
Effective thermal management for demanding applications require materials that can provide high bulk conductivity and low thermal resistance. Formulated to allow high loading of thermally conductive fillers and designed to achieve very thin bond line thicknesses, Dow Consumer Solutions' thermally conductive silicone compounds deliver on both counts.
These advanced silicone solutions flow easily to cover and fill surface irregularities to provide efficient, effective dissipation of damaging heat away from sensitive components. Applied via screen or print processes or by standard dispensing equipment, our thermal compounds are non-curing, minimizing equipment needs, improving throughput and lowering the total cost of ownership.