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DOWSIL™ EA-4600 LV HM RTV Translucent

  • Overview

    This translucent silicone adhesive is designed for electronic assembly applications. The product dispenses as a low viscosity material using standard hot-melt dispensers, including those equipped with jet dispensing applicators. It cures in the presence of atmospheric moisture to a strong adhesive.

    Enhanced Productivity
    Handling and assembly operations possible before full cure

    Easily Reworkable
    Softens when heated, regains typical properties when cooled

    Improved Reliability
    Protects from chemicals, moisture, dust and other environmental contaminants and absorbs
    impact energy

    Slimmer Smart Devices Manufactured More Simply

    For years, smart devices have continued to trend toward slimmer, sleeker exteriors, which still incorporate numerous, complex parts and assemble together quickly and durably during manufacture. To cope with these often conflicting trends, the industry needs high-performance adhesives that can quickly form strong bonds to support innovative new designs and to accelerate production cycles.

    Advanced silicone Hot-Melt Adhesives from Dow Consumer Solutions are developed specifically for next-generation smart devices. These reactive, moisture-cure adhesives are applied as a hot liquid melt that cools at room temperature to quickly form strong but flexible viscoelastic bonds to plastic and metal substrates that are commonly used in smart devices.

    Our silicone Hot-Melt Adhesives offer lower total cost of ownership compared to double-sided tape and conventional thermal cure adhesives. Select Hot-Melt Adhesive products actually enable a 5x improvement in the total cost of ownership vs. double-sided tape, based on 100 million smart phone window bonding operations that incorporate 0.8 mm bezels.

    Why use DOWSIL™ Hot-Melt Adhesives?

    • Improved dispensability: Good dispensability using standard hot melt dispensers, including jet dispensing applicator.
    • Enhanced productivity: Uniquely formulated to allow precision microbeading (≤ 0.5 mm bead width) and achieve instant green strength when dispensed, our high-performance Hot-Melt Adhesives allow handling and assembly operations to proceed before full cure.
    • Easy reworkability: When exposed to high temperatures these advanced materials soften to allow easy reworkability, but regain their typical properties after cooling.
    • Improved reliability: After cure, the proven chemistry of our innovative silicone adhesives offers reliable, long-lasting protection against chemical, moisture, dust and other environmental contaminants to help extend the life and performance of your smart device design. Additionally, due to silicone’s natural flexibility, these adhesives can absorb impact energy to enhance shock and impact resistance.
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