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DOWSIL™ EG-4120 Kit

  • Overview

    High temperature stability gel, suitable for operating temperature ranging from -40C to + 200℃ in continuous mode and > 3,000 hours at 215℃. Tough gel for increased resistance to delamination under thermal cycling.

    DOWSIL™ EG-4120 Dielectric Gel is a two-part, tough, self-priming gel. This encapsulant’s uncompromised stability allows for un-impeded curing in a large temperature range between -40° C to 215° C for extended periods of time. DOWSIL™ EG-4120 Gel, much like its companion gels in the 4XXX series react during mixing to become tough soft gels.

    DOWSIL™ EG-4120 Dielectric Gel delivers:

    • Stability of electrical/mechanical properties under harsh temperature conditions
    • No surface cracking or delamination from component housing
    • Protection of delicate circuits and interconnections from surface contaminats and moisture

    The properties of DOWSIL™ EG-4120 Dielectric Gel makes it suitable for a range of applications including:

    • Potting of IGBT modules used for power conversion
    • Protection of PCB and sensitive devices operated hat high temperatures
    • Industrial sensors and actuators
    • Insulation of high voltage devices
99120651z

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