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DOWSIL™ TC-3015 Thermal Gel

  • Overview

    DOWSIL™ TC-3015 Re-workable Thermal Gel is one part, heat cure silicone based thermally conductive gel with good re-workability. It’s supplied as non-flowable paste and can be pressed lower to 100 um thickness in thermal management application. It can be cured to elastic pad with certain tensile strength and elongation which can make sure the material can be peeled off easily and completely without residue in rework process.

    Good re-workability
    100% peeling off without residue

    Room temprature curing
    Fast curing at room temprature

    Excellent thermal management
    Reduces contact resistence better than thermal pads

    DOWSIL™ TC-3015 Thermal Conductive Silicone Gel is a one-part silicone formulation for thermal management of smartphone components.

    It is generally cured at room temperature, eliminating the need for a separate curing process. Alternatively, faster curing is possible by exposing the material to temperatures of up to 150°C.

    Excellent wettability ensures low contact resistance and even thermal management without hot spots for the integrated circuit (IC) and central processing unit (CPU), the hottest smartphone component.

    As a printable or dispensable product, DOWSIL™ TC-3015 Thermal Conductive Silicone Gel can be integrated into automated processes, avoiding the need for time-consuming application of fabricated thermal pads.

     

    Learn More

    • Watch the video and see how this innovative material can be automatically dispensed for improved manufacturing efficiency and can be peeled off intact – with no residue – for easy repair.
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