Gray, flowable, non-curing thermally conductive compound. Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of modules, including computer MPUs and power modules.
用途
DOWSIL™ TC-5630 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of devices including computer MPUs and CPUs in servers, laptops and notebooks
利点
Highly flowable for easy application
Solventless formulation
Low density
Can achieve thin bond line thickness and low thermal resistance