What is DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler?
A soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
Uses
DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit
Benefits
Thermal conductivity: 3.5 W/m.K
Room temperature cure or heat accelerated cure
Long term performance stability during temperature cycling up to 150°C
Holds vertical position in the assembly for long service period